The newly launched CPC-Auto online chip-type vacuum plasma cleaner by CIF is a highly efficient and automated surface treatment system, specifically engineered for chip packaging applications. It enables precise cleaning and surface activation of substrates prior to critical processes such as die bonding, wire bonding, and flip-chip assembly.

Compared with traditional stand-alone equipment, this model has outstanding comprehensive advantages:

• High degree of automation: It supports integration into assembly lines, enabling continuous sheet transmission, significantly enhancing cleaning efficiency and production capacity.
• Excellent cleanliness: The fully enclosed vacuum design combined with a clean gas environment prevents secondary contamination, meeting the requirements of high-reliability packaging.
• Wide application range: It can be adapted to various sizes and materials of chip carriers, flexibly meeting diverse production needs.
• Low overall cost: The equipment features a compact design, stable operation, and easy maintenance, resulting in significantly lower energy and maintenance costs over time compared to traditional models.

The CPC-Auto series combines efficiency, cleanliness, and economy, making it an ideal surface treatment solution for large-scale fully automated packaging production.

Function & Features

1. High Compatibility and Efficient Design

Flexible and Adjustable Conveyor Track: Supports simultaneous cleaning of products with four different widths, accommodating diverse production requirements.  

• Sheet-Type High-Efficiency Cleaning System: Utilizes Sheet-type transmission technology to ensure uniform and consistent cleaning performance across all batches. 
• Continuous Operation with Dual Cleaning Trays: Features two interchangeable cleaning trays for simultaneous material loading and cleaning, greatly enhancing production efficiency.

2. Intelligent Operation and Error-Prevention System

• Unilateral loading and unloading with anti-mixing batch functionality: Products are loaded and unloaded in the same container, which automatically returns to its designated position, preventing the risk of material mixing between batches.   
• One-Click Product Changeover and Parameter Recall: Upon product change, the system automatically retrieves and applies preconfigured parameters without requiring manual intervention. 
• One-Click Switching Between Manual and Automatic Modes: The user interface is intuitive, enabling one-click activation and termination in both modes for ease of use.

3. Reliable Safety Mechanisms and Stable Performance

• Independent Four-Channel Monitoring: Each of the four processing channels features an independent detection system, enabling precise fault localization and ensuring process consistency. 
• Comprehensive Safety Protections: Features dual safety mechanisms-interlocked chamber door and real-time pressure monitoring-to prevent deformation and ensure operator and equipment safety.
• Modular and Robust Structural Design: Adopts a modular architecture to ensure stable and reliable operation, simplifying maintenance procedures and supporting future system upgrades.

Technical Specification