The latest technological innovations of the Thermo Scientific™ Helios G4 DualBeam™, in combination with the easiest to use, most comprehensive software and our application expertise, allow for the fastest and easiest preparation of site-specific, ultra-thin HR-S/TEM samples for a wide range of materials. In order to achieve the highest quality results, final polishing with very low energy ions is required to minimize surface damage on the sample. Our most advanced Phoenix Focused Ion Beam (FIB) column not only delivers high-resolution imaging and milling at high voltages, but it now extends unmatched FIB performance down to accelerating voltages as low as 500V, enabling the creation of ultra-thin TEM lamella with sub-nm damage layers.