The CIF powder-specific plasma cleaning machine is specially designed for fine materials such as powder and particles. It breaks through the technical bottleneck of traditional vacuum plasma equipment when handling powder samples, and can efficiently process ultra-fine powder at the micron and even nanometer level. At the same time, it is fully compatible with the high-quality cleaning and surface treatment requirements of conventional materials.

Why choose plasma treatment for processing powders?

Traditional methods are difficult to uniformly and efficiently process fine powders. The CIF powder plasma cleaning machine, through non-contact and low-temperature plasma technology, precisely and controllably modifies only the surface of the powder while fully maintaining its original properties. It is a key process for enhancing the added value of powders and expanding their application boundaries.

Working Principle

The equipment is equipped with a dedicated sample bottle that can rotate and stir in a specially designed vacuum chamber. High-energy plasma is generated by the radio frequency power supply, creating an active environment inside the bottle. The powder is fully and evenly exposed in all directions through continuous rotation and stirring. Through physical bombardment and chemical reactions by the plasma, dynamic and uniform treatment is achieved, resulting in the targeted optimization of surface properties.

Four processing effects enhance powder material performance

Controllable wetting property conversion: Achieving on-demand changes in surface hydrophilicity and hydrophobicity.

Enhanced dispersion and compatibility: Significantly improving the dispersion stability and interfacial adhesion of powders in different media (water or organic solvents).

Introduction of active functional groups: Grafting new chemical groups (such as -OH, -NH₂, etc.) onto the surface without damaging the bulk, endowing new properties.

Cleaning and activation: Effectively removing surface organic contaminants and activating surface energy, enhancing the performance of subsequent coating, bonding, and other processes.

Applications

Powder plasma cleaning machine is mainly used in the following fields.

Area	Purpose	Typical materials
Inorganic powder	Inhibit agglomeration, enhance dispersion in composite materials, and improve mechanical, optical and other properties.	Silicon micro-powder, aluminium hydroxide, aluminium oxide, ceramic powder, etc
Organic/polymer powder	Adjust the surface bond energy and wettability, enhance the bonding strength, and introduce functional groups for subsequent processing.	Polymer micro-powder, engineering plastic powder, graphene, nanomaterials, etc
Surface functionalization	Realize surface grafting, coating or cross-linking to endow the powder with brand-new specific functions (such as catalysis and antibacterial).	Functional fillers, drug carriers, precursors of composite materials, etc.
Paints and inks	Improve the dispersion and stability of pigments and fillers in the system to enhance the performance of the finished product.	All kinds of pigment and filler powders.

Function & Features

±  Intelligent interactive interface: Featuring a 7-inch color touchscreen, the system supports bilingual operation in Chinese and English. It enables real-time monitoring and automatic adjustment of process parameters. With 20 pre-programmed recipes, the system allows for efficient storage and traceability of process data.

±  Reliable control system: It adopts PLC for full-process control and supports both manual and automatic operation modes to ensure a stable and reliable cleaning process.

±  Bidirectional intelligent vacuum control: The system can precisely control the vacuum degree through two modes of adjusting gas flow or chamber pressure, providing more flexible and intelligent process control to meet diverse precision processing requirements.

±  Precise gas management: Equipped with mass flowmeters, it supports various gas sources such as oxygen, argon, nitrogen, hydrogen and mixed gases, with high control accuracy.

±  Uniform and efficient: The dynamic stirring design ensures that each powder particle achieves a uniform and consistent processing effect.

±  Precise and controllable: Process parameters (time, power, gas) can be precisely regulated to achieve targeted surface modification.

±  Safety and environmental protection: Dry processing throughout the entire process, no chemical solvents required, and no pollution.

±  Wide application: One machine for multiple uses, compatible with surface engineering requirements of various inorganic, organic and composite powder materials.

Technical Specification

Module	Model	CPCP3 Plus
Core System	Generator	13.56MHz, 10-150W, adjustable
	Plasma Excitation	Inductively Coupled (ICP)
	Matcher	Fully automatic impedance matching
	Vacuum pump	Pumping speed: 4m³/h, Vacuum degree: less than 100pa
	Gas Stable Time	1 min
Chamber	Chamber Material	Quartz glass
	Chamber Size	D200XΦ160mm
	Chamber Volume	4.0L
	Quartz Bottle Size	Φ75xH120mm
	Rotation Speed	0-100rpm, adjustable
Process Control	Gas Control	dual float flowmeters
	Time Setting	9999 sec
Physical & Power Supply	Power Supply	AC220V, 50/60Hz, 428W
	Product Size	L440xW410xH455mm
	Packing Size	L580xW580xH695mm
	Net Weight	32kg

 

CIF is a Chinese manufacturer of plasma cleaners, UV Ozone cleaners, spin coaters. Our factory covers an area of over 4000 square meters. We have obtained a number of patents and have passed GB/ T19001-2016 /ISO9001-2015 quality management system certification, GB/T24001- 2016/ISO14001:2015 environmental management system certification.